The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2001

Filed:

Jan. 11, 1995
Applicant:
Inventor:

Atsuyoshi Koike, Kokubunji, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/546 ;
U.S. Cl.
CPC ...
G06F 1/546 ;
Abstract

A semiconductor integrated circuit device fabrication method has a main processing line and a sub-processing line. The main processing line includes a plurality of main batch processing sections, each of which processes a plurality of main objects at a time, and a plurality of main sequential processing sections, each of which processes a minimum number of main objects at a time. The main processing line feeds the main objects to the main batch processing sections and the main sequential processing sections for predetermined processing. The sub-processing line includes a plurality of sub-processing sections, each of which performs processing identical with that of a corresponding main batch processing section on a minimum number of sub-objects and certain of the main sequential processing sections. The sub-processing line feeds the sub-objects to the sub-processing sections and the main sequential processing sections for predetermined processing.


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