The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2001
Filed:
Jun. 14, 1999
Applicant:
Inventors:
German Ramirez, Antioch, CA (US);
Serafin Padilla Pedron, Jr., Manteca, CA (US);
Assignee:
Advanced Technology Interconnect Incorporated, Manteca, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/310 ;
U.S. Cl.
CPC ...
H01L 2/310 ;
Abstract
A semiconductor package comprising: (a) at least one semiconductor device; (b) a metal heat spreader that has at least one surface exposed to ambient and the perimeter of that exposed surface having a seal ring border; (c) a leadframe having a plurality of inner and outer leads, said inner leads interconnected to said semiconductor device; and (d) a molding resin encapsulating said semiconductor device, said inner leads of said leadframe and all of the heat spreader except that exposed surface having the seal ring border.