The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2001
Filed:
Jun. 30, 1999
Thomas R. Miller, Endwell, NY (US);
Kristen A. Stauffer, Vestal, NY (US);
Michael Wozniak, Vestal, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic structure, and associated method of formation, in which a plated metallic layer such as a copper layer, of a plated through hole (PTH) is adhesively coupled to holefill material distributed within the PTH. The holefill material includes a resin such as an epoxy and optionally includes a particulate component such as a copper powder. The adhesive coupling is accomplished by forming an adhesion promoter film on the plated metallic layer such that the adhesion promoter film is bonded to the resin. The adhesion promoter film may include a metallic oxide layer such as layer containing cupric oxide and cuprous oxide, which could be formed from bathing the PTH in a solution of sodium chlorite. Application of a reducing solution of dimethylamine borane to the cuprous oxide layer would convert some of the cuprous oxide to cupric oxide in the metallic oxide layer. Another possibility for an adhesion promoter film is an organometallic layer such as a layer that includes a chemical complex of metal and an organic corrosion inhibitor. Useful organic corrosion inhibitors for this purpose include triazoles, tetrazoles, and imidazoles. The organometallic layer could be formed from bathing the PTH in a bath of hydrogen peroxide, sulfuric acid, and an organic corrosion inhibitor.