The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2001
Filed:
Nov. 04, 1999
Chin-Yung Wu, Miaoli Hsien, TW;
Tay-Yuan Chen, Changhua Hsien, TW;
Abstract
The present invention provides a process for underfill encapsulating a flip chip which is driven by pressure. First, a metal foil is placed on a flip chip that has been connected to a substrate. Then, a downward pressure is applied to the metal foil so as to form a space among the metal foil, the flip chip, and the substrate. Then, an encapsulant is filled into the space under pressure. The chip on which the metal foil has been placed and that has been encapsulated is moved away. Then, another metal foil is placed on another flip chip that has been connected to the substrate to undergo the above-mentioned encapsulation process. Encapsulation of the next chip can begin without waiting the encapsulant packaging the prior chip to cure. Thus, the efficiency of the encapsulating machine can be greatly enhanced, and the conventional problems of encapsulant adhering to the mold can also be solved. After the encapsulant is cured, if the metal foil is left on the chip, the final chip package can achieve some special effects including heat dissipation, electromagnetic interference (EMI), and electric static discharge (ESD).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile