The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2001
Filed:
Sep. 10, 1998
M. Ishaq Haider, Bernardsville, NJ (US);
John Anthony Flint, Berkeley Heights, NJ (US);
Michael Jaffe, Maplewood, NJ (US);
Joseph J. DiBiase, Nazareth, PA (US);
John Edward Cornetta, Chester, NJ (US);
Celanese Acetate LLC, Charlotte, NC (US);
Abstract
The present invention discloses and claims a novel process for the formation of high denier as-spun and heat-treated multilobal filaments of a thermotropic liquid crystalline polymer. Preferred embodiments include process for the formation of as-spun and heat treated octalobal monofilaments of a few wholly aromatic polyesters and polyesteramides. The process involves (a) heating of a thermotropic liquid crystalline polymer to above its melting transition temperature; (b) passing said molten polymer through an extrusion chamber equipped with an extrusion capillary having a multilobal cross-section to form a multilobal filament; and (c) winding the filament at a suitable draw-down. The filaments so formed are of at least 50 denier per filament (dpf) and feature essentially uniform molecular orientation across their cross-section. In a final optional step, the filaments are heat treated in stages to form filaments exhibiting excellent tensile properties. Both as-spun and heat-treated filaments feature remarkably good tensile properties comparable to those of round filaments. Most importantly, the multilobal filaments of this invention feature much superior adhesion properties than the conventional round filaments.