The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2001
Filed:
Sep. 03, 1998
Katsuhiko Onoda, Shizuoka, JP;
Yazaki Corporation, Tokyo, JP;
Abstract
A connector molding method in which the accuracy of positioning of a plurality of metal terminals is enhanced, and also even if part of a housing is formed into a thickened portion, a shrink mark and a warp will not develop in the molded connector. At a first stage of the connector molding method of the invention, a plurality of male metal terminals are kept insulated from one another, and in this condition these metal terminals are insert molded, thereby forming a primary molded body. Then, at a second stage, the primary molded body is properly positioned, and is insert molded, thereby forming a secondary molded body which is a final molded product (connector). In order to prevent the development of a shrink mark and a warp due to the formation of a thickened portion of the connector, a core portion of the thickened portion is formed at the time of molding the primary molded body, and a shell portion of the thickened portion, having a generally uniform thickness of 1 mm to 2 mm, is formed at the time of molding the secondary molded body. The core portion of the primary molded body is utilized for the positioning for the second molding, and therefore the male metal terminals can be positioned highly precisely.