The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2001
Filed:
Jun. 19, 1998
Kazutoshi Takayama, Hanishina-gun, JP;
Kiyoto Takizawa, Hanishina-gun, JP;
Nissei Plastic Industrial Co., Ltd., Nagano-ken, JP;
Abstract
An injection molding process wherein the times of heating to melt a resin are reduced to minimize the thermal hysteresis and to decrease the deterioration of physical properties caused by the thermal hysteresis, so that high quality information recording disks may be produced. A molding process wherein the plasticating and the injection and filling of a material resin are carried out in separate cylinders, allows constant molding for a long period of time. A material resin such as polycarbonate is supplied without predrying to an injection apparatus for a first time molding. Resin is kneaded by the apparatus while volatile components are heated to be vaporized and exhausted through a vent port. An inert gas atmosphere is provided within the cylinder to prevent the material resin from being oxidized. Since predrying can be dispensed with, the thermal hysteresis will be extremely small and the deterioration of the resin caused by such heating may be suppressed. Also, there is less chance of generation of carbonized black spots caused by foreign matter, molding failures caused by hydrolysis may be eliminated, and residual monomers can be vaporized and exhausted concomitantly.