The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2001
Filed:
Mar. 31, 1998
Akinori Ide, Fujinomiya, JP;
Takehiro Yamamoto, Numazu, JP;
Toshiba Kikai Kabushiki Kaisha, Tokyo, JP;
Abstract
Molten polymers are forced into T dies combined to form a multiple T die, the molten polymers are extruded through the T dies in monolayer. The monolayers extruded through the T dies are superposed and laminated outside the multiple T die while the polymers are in a molten or semi-molten state to form a intermediate molten multilayer. The multiple T die is advanced into a space between an open top half mold and a bottom half mold of a compression mold to deliver the intermediate multilayer onto the bottom half mold. The intermediate multilayer is cut to a predetermined length on the bottom half mold, and is processed for compression molding in the compression mold to form a multilayer article. A molding cycle for molding the multilayer article is carried out automatically at a remarkably improved manufacturing efficiency.