Article comprising a standoff complaint metallization and a method for making same

Abstract

Compliant standoffs are disposed on a support surface of a semiconductor or hybrid semiconductor device. The standoffs extend further from the support surface than other active or passive structures associated with the (hybrid) semiconductor device, and are spaced at least a minimum distance from such associated structures. Each compliant standoff provides a surface at which auxiliary devices, such as optical subassemblies, lightwave circuits and the like, can be attached. Since the compliant standoffs extend further from the support surface than other associated structures, such other associated structures are protected from potentially damaging contact with the auxiliary device(s) being attached to the compliant standoffs. Moreover, since the compliant standoffs are spaced from such other asociated structures, potentially damaging thermal and mechanical stresses (imparted to the standoffs as a result of the contact with an auxiliary device such as during bonding) are substantially dissipated by the compliant standoff and directed into the support rather than the other associated structures. The compliant standoffs advantageously comprise conductive materials such that they may be placed in ohmic electrical contact with at least one active region of the (hybrid) semiconductor device.