The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2001
Filed:
Dec. 29, 1998
Hidekazu Toda, Kyoto, JP;
Shinji Isokawa, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
The LED element is die-bonded on the wiring pattern on the surface of the first white substrate facing to the cavity of the second white substrate by using electrically conductive materials as bonding material so that the LED element is accommodated in the cavity of the second white substrate and the p and n side electrodes on one side opposite to the light emitting surface of the sapphire substrate of the LED element are electrically connected with the through-hole conductors. The LED element which is die-bonded on the first white substrate is covered and sealed on its entire periphery with a light transmittable synthetic resin molded portion. The semiconductor light emitting device may have an enhanced light emission efficiency and can be formed in the flat form.