The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2001
Filed:
Dec. 07, 1998
Applicant:
Inventors:
Hajime Imano, Tokyo, JP;
Yoshikazu Kato, Tokyo, JP;
Assignee:
Adtec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/204 ; H05K 1/11 ;
U.S. Cl.
CPC ...
H01R 1/204 ; H05K 1/11 ;
Abstract
A printed wiring device includes an insulation layer, a base layer, i.e. grounding layer or power supply layer, disposed on the insulation layer, and a signal line disposed on the insulation layer at the opposite side of the base layer. A plurality of holes is formed in the base layer opposite to the signal line, so that an average capacitance value between the signal line and the base layer is decreased. Thus, even if the insulation layer is thinned without narrowing the width of the signal line, characteristic impedance of the signal line can be controlled at a desired value.