The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2001

Filed:

Apr. 18, 1997
Applicant:
Inventor:

Moritaka Nakamura, Yokohama, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract

An interconnection pattern made of aluminum alloy, such as Al-Cu, on a semiconductor IC, is dry etched in an etching gas containing a chlorine component. Residual chlorine components on the substrate are difficult to remove, thus causing corrosion problems with respect to the patterned aluminum alloy layer. Accordingly, to prevent such corrosion, a photo resist stripping process is carried out at a location down stream of the etching process using a conventional stripping gas, such as CF,+O,, at room temperature. Next, and before the resist-stripped substrate is exposed to open air, the substrate is heated in a vacuum to a temperature above 100° C., to thus remove residual chlorine components. In an alternative method, the heating process is carried out concurrently with the resist stripping process.


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