The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2001

Filed:

Sep. 25, 1998
Applicant:
Inventors:

Willi Martin, Reichertshausen, DE;

Hans-Friedrich Siegling, Egmating, DE;

Marcel Kuhn, Kaiserslautern, DE;

Norbert Himmel, Bad Kreuznach, DE;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B64C 3/44 ;
U.S. Cl.
CPC ...
B64C 3/44 ;
Abstract

A load carrying structure having a selectively rigid or flexible characteristic includes a thermoplastic material (,) having a softening temperature above the operating temperature range of the load carrying structure, and a heating arrangement (,) provided to selectively heat the thermoplastic material to above its softening temperature. During normal operation, the thermoplastic material is in a rigid state and the overall load carrying structure is rigid to the prevailing loads. By activating the heating arrangement to heat the thermoplastic material to at least its softening temperature, the thermoplastic material and therewith the load carrying structure becomes flexible so that it may be deformed to a different configuration by applying a deforming load. Once the desired deformed configuration is achieved, the heating arrangement is deactivated, and the thermoplastic material is allowed to cool below its softening temperature so that it once again becomes rigid and rigidly fixes the new deformed configuration. The deforming force may be applied by any actuating mechanism, or for example by arranging shape memory alloys in connection with the thermoplastic material.


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