The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2001
Filed:
Dec. 10, 1998
Wai Mon Ma, Poughkeepsie, NY (US);
James J. Petrone, Hyde Park, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A nozzle is provided for the reworking of printed circuit boards with CBGA and CCGA solder containing chips comprising a housing having an internal hot gas chamber and configured to hold at the lower end of the nozzle a chip to be attached to the printed circuit board. The nozzle is provided with a support member and resilient means on the lower surface thereof which resilient means contacts the upper surface of the chip when the chip is placed in the nozzle. When a vacuum is applied to the nozzle the chip is held against the resilient means and compresses the resilient means so that the lower portion of the solder array is below the lower end of the nozzle. When the nozzle is then placed against a printed circuit board, the resilient means provides a pressure force against the chip and the printed circuit board which enables rework of the printed circuit board even though the printed circuit board may be warped.