The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2001
Filed:
Jan. 29, 1998
Nippei Toyama Corporation, , JP;
Abstract
An apparatus for manufacturing a plurality of wafers by slicing a cylindrical ingot with a wire saw. The apparatus includes a measuring device for measuring the crystal orientation of the ingot; an adhering device for adhering a support to the surface of the ingot based on the orientation where the support includes an intermediate plate and a support plate, where the support plate is adapted to fit the wire saw, and where the adhering device includes an auxiliary adhering element for adhering the intermediate plate to the surface of the ingot and an adhering element for adhering the support plate to the intermediate plate; a dryer for drying and solidifying an adhesive applied between the ingot and the intermediate plate and an adhesive applied between the intermediate plate and the support plate; and the wire saw for slicing the ingot into the plurality of wafers while the ingot is supported on the support. The apparatus may include stockers for storing the ingot and transferring devices for transferring the ingot within the apparatus.