The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2001

Filed:

Apr. 22, 1999
Applicant:
Inventors:

Tomoko Nobutoki, Tokyo, JP;

Kouji Mine, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 8/00 ;
U.S. Cl.
CPC ...
G11C 8/00 ;
Abstract

It is an object of the invention to provide a semiconductor memory device with a reduced access time by devising a layout of a circuit without elaborate modification. A Y address buffer is situated on the side of an address pad array (the right side), and outputs a signal for controlling Y address decoder situated on the right side and a circuit block communicated therewith. The Y address decoders on the right side control the Y addresses of memory cells in the memory cell arrays C and D in case that data are read therefrom or written thereinto. The circuit block communicated with the Y address buffer outputs a signal to the address decoders on the side of a DQ pad array (the left side) in accordance with the signal inputted from the Y address buffer. The Y address decoders on the left side control the Y addresses of the memory cells in the memory cell arrays A and B in accordance with the signal inputted from the circuit block communicated with the Y address buffer. Data amplifiers combined with the memory cell arrays A, B, C and d respectively amplify the data read from the memory cells in the memory cell arrays A, B, C and D. The circuit blocks situated on both the side ends of a semiconductor chip respectively output activation signals for activating the data amplifiers combined with the memory cell arrays A, B, C and D. The data amplifier-activation signals outputted from the circuit blocks on the left side end are respectively inputted to the delay circuits DL,and DL


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