The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2001

Filed:

Nov. 16, 1994
Applicant:
Inventors:

Tom Feng, Hopewell Junction, NY (US);

Joel Askinazi, Trumbull, CT (US);

Assignee:

Raytheon Company, Lexington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/08 ;
U.S. Cl.
CPC ...
G02B 5/08 ;
Abstract

A method of fabricating an infrared (IR) window (,) which has a high transmittance at IR frequencies includes the steps of providing a protective layer (,) and an IR substrate (,) each having a high IR transmittance. An inner surface (,) of the protective layer (,) and an outer surface (,) of the IR substrate (,) are contacted without adhesive therebetween. The protective layer (,) and the IR substrate (,) are annealed at a bonding temperature. Anti-reflection coatings (,), (,) can be applied to an outer surface (,) of the protective layer (,) and to an inner surface (,) of the IR substrate (,). The IR window (,) can be installed as a shield for an IR sensor mounted on an aircraft. The IR window (,) can be removed from the aircraft and the protective layer (,) and the IR substrate (,) can be debonded by heating the IR window (,) above the bonding temperature. The protective layer (,) and the IR substrate (,) can be separated and a new protective layer (,) can be provided. An inner surface,of the new protective layer (,) and an outer surface (,) of the IR substrate (,) can be contacted at ambient temperature without adhesive therebetween. The new protective layer (,) and the IR substrate (,) can be annealed at a bonding temperature.


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