The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2001

Filed:

Apr. 19, 1999
Applicant:
Inventor:

Martin G. Meder, Catasauqua, PA (US);

Assignee:

Lucent Technologies, Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/12 ;
U.S. Cl.
CPC ...
H01P 3/12 ;
Abstract

A microwave circuit includes a waveguide, an e-bend, an h-bend, a magic tee, a connector, a coupler, a window, an adaptor, a horn, a switch, a transmitter, or an amplifier circuit. The microwave circuit has a metal surface. A fluid layer is deposited on the metal surface containing either a silicone or a silicone precursor. The fluid may be a volatile solvent containing about 0.5 percent silicone. The fluid may contain a mercapto functional copolymer, and may be dimethyl-co-methylmercaptopropyl siloxane. The fluid may be applied by brushing or dipping. Alternatively, the silicone or silicone precursor may be sprayed on by: bubbling nitrogen through a liquid containing the silicone or silicone precursor to saturate the nitrogen, and blowing the saturated nitrogen across the metal surface of the microwave circuit to deposit the silicone precursor thereon. The liquid may contain dimethyldimethoxysilane and dimethylmercaptopropyldimethoxysilane. After applying the fluid containing the silicone or a silicone precursor, an optional waiting step may be included, before transmitting microwave energy through the microwave circuit.


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