The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2001

Filed:

Jul. 29, 1999
Applicant:
Inventors:

Hsien-Yin Tsai, Tainan, TW;

In-Mau Chen, Chu-Pang, TW;

Wen-Faa Kuo, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
C08F / ;
Abstract

A resin composition which increases the copper peeling strength and improves the dielectric properties of electric circuit boards is disclosed. The resin composition comprises: (a) 20-100 parts by weight of a syndiotactic polystyrene, (b) 1-40 parts by weight of a functionalized syndiotactic styrene-based copolymer having microfoaming when being cured, (c) 1-40 parts by weight of an epoxy-styrene copolymer, and (d) 0-40 parts by weight of an additive.


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