The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2001
Filed:
Jan. 27, 1998
Applicant:
Inventors:
Sanjay B. Moghe, Hoffman Estates, IL (US);
Gregory R. Dietz, Schaumburg, IL (US);
Howard N. Fudem, Baltimore, MD (US);
Assignee:
Northrop Grumman Corporation, Los Angeles, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/182 ;
U.S. Cl.
CPC ...
H01L 2/182 ;
Abstract
A footprint for adaptable MMIC arrays is disclosed in which the size, number and location of the array components is optimized for the fabrication by depositing a personalizing metal interconnecting layer on the array, of essentially any MMIC circuit from a single footprint layout.