The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2001
Filed:
Apr. 01, 1999
Robert Sikora, San Jose, CA (US);
Adalberto M. Ramirez, Hayward, CA (US);
Maurice Evans, Pacifica, CA (US);
Yongbum (Peter) Cuevas, Los Gatos, CA (US);
Robert Sylvia, Santa Clara, CA (US);
Qualitau, Inc., Sunnyvale, CA (US);
Abstract
A socket for use in testing packaged integrated circuits having leads depending therefrom includes a first member for receiving the integrated circuit package and having a plurality of holes for receiving leads extending from the package. A second member has a plurality of wire contacts for engaging the leads, the first and second members being arranged to permit relative lateral translation thereof. A cam is provided for sliding the first member relative to the second member and moving leads extending through the holes in the first member into engagement with the contacts of the second member. A socket for dual in-line integrated circuit package (DIP) has two rows of holes in the first member, and two slots are provided in the second member each aligned with a row of holes. The wire contacts extend across each slot. For high temperature operation (greater than 250° C.) the first and second members comprise anodized aluminum or a ceramic, and the wires comprise Monel or other high temperature material.