The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2001

Filed:

Nov. 21, 1997
Applicant:
Inventors:

Stuart D. Downes, Milford, MA (US);

Leonard A. Merrill, Millis, MA (US);

Assignee:

EMC Corporation, Hopkinton, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/340 ;
U.S. Cl.
CPC ...
H01R 1/340 ;
Abstract

An electrical contact that is mounted on a printed circuit board to provide an electrical connection to the printed circuit board. The contact has the structural integrity of a through-hole component with the capability of being soldered to the circuit board using a surface mount reflow process. The contact includes a pair of elongated, conductive pins with a base disposed therebetween, and a solder preform supported on one of the conductive pins adjacent the base. The pin supporting the solder preform is insertable into a plated-through hole on the circuit board so that the solder preform can be reflowed into the hole along the pin to form a solder joint between the contact and the hole. The contact may include a retainer to secure the solder preform to the pin and the end of the base adjacent the pin may be beveled to facilitate gas ventilation from the hole during the soldering process. The base may be configured so that it can be grasped with a test instrument or support a wire connection to the contact. The contact may be symmetrical so that the solder preform can be supported on either conductive pin.


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