The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2001
Filed:
Feb. 09, 1999
Kevin L. Haas, Bartlett, IL (US);
Kiron P. Gore, Libertyville, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An improved punch out pattern for a hot melt tape used in smartcard manufacture. The hot melt tape is provided with punch out channels that direct the overflow of conductive adhesive away from the surface of the hot melt tape. In a preferred embodiment, the punch out channels are dimensioned to direct the overflow away from one another and toward a module receiving cavity formed in the smartcard body. In an alternate embodiment where it may not be feasible to direct overflow toward the overmold receiving cavity without affecting the electrical or mechanical performance of the smartcard, the punch out channels are dimensioned to direct overflow away from one another and along the periphery of the hot melt tape area. In either scenario, the channels do not interfere with module adhesion and, by virtue of the channeling of overfill matter, direct the conductive adhesive away from other connections in close vicinity and thus avoid the possibility of shorting.