The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2001
Filed:
Sep. 08, 1998
Yong-min Jun, Kyonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A method for controlling thicknesses of layers formed by a deposition apparatus for semiconductor device fabrication includes retrieving a latest process record for a latest batch from a process database for a deposition apparatus. Each process record in the database describes one layer deposition process using the deposition apparatus operating on one batch. A batch includes a plurality of lots, each lot having a workpiece. The method further includes receiving a latest array of thicknesses, each thickness from one lot of the latest batch. Then an automatic corrected setting is calculated. If the automatic corrected setting is within a specification setting range, the specification is met and the method continues. A next batch signal is input if the layer deposition process may proceed on a next batch, and the automatic corrected setting is displayed. A predetermined correction command is input to indicate a predetermined corrected setting is to be used instead of the automatic corrected setting. The automatic corrected setting is downloaded to the deposition apparatus when the predetermined correction command has not been input.