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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6178095 B1

PDFFull Text
Date of Patent:
Jan. 23, 2001

Filed:

Jul. 29, 1998

Structure for fixing an element to a printed wiring board, and electronic equipment having the structure

Applicant:
Inventors:

Katsuichi Goto, Kawasaki, JP;

Taiji Mizunaga, Kawasaki, JP;

Yukiya Kojima, Kawasaki, JP;

Sonomasa Kobayashi, Kawasaki, JP;

Takumi Kishi, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:

Staas & Halsey LLP

Primary Examiner:

Leo P Picard

Assistant Examiner:

Hung Van Duong

Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

The present invention relates to a structure for fixing an element to a printed wiring board. The fixing structure includes a spacer, the printed wiring board, and a sealant. The spacer has a first end to which the element is to be fixed and a second end to be fixed to the printed wiring board. The printed wiring board has a hole having a shape determined in relation to the shape of the second end of the spacer. The sealant is filled in the hole of the printed wiring board to fix the second end of the spacer to the printed wiring board. The second end of the spacer has a projection having a length smaller than the thickness of the printed wiring board and located in the hole of the printed wiring board. With this configuration, the projection of the spacer or the sealant is prevented from projecting from a first surface of the printed wiring board opposite to its second surface for fixing the spacer, so that electronic equipment adopting this fixing structure can be reduced in size (in thickness) and a component mounting area of the first surface of the printed wiring board can be increased.

Find Patent Forward Citations

Goto, Katsuichi. (2001). Structure for fixing an element to a printed wiring board, and electronic equipment having the structure (U.S. Patent No. 6178095). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6178095

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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