The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2001
Filed:
Oct. 02, 1998
Shigeru Yamada, Tokyo, JP;
Yasufumi Uchida, Tokyo, JP;
Noriko Murakami, Tokyo, JP;
Yoshinori Shizuno, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor element having a plurality of electrodes on an upper surface thereof. A first substrate has a plurality of conductors on an upper surface thereof. The first substrate is mounted on the upper surface of the semiconductor element and is smaller in area than the semiconductor element. A second substrate has a plurality of solderballs on an upper surface thereof. The second substrate is mounted on the upper surface of the first substrate and is smaller in area than the first substrate. An adhesive layer is disposed between the first substrate and the semiconductor element, and causes the first substrate to be affixed to the semiconductor element. A plurality of metal wires electrically couple the electrodes on the semiconductor element to the conductors on the first substrate. A sealing frame is attached to the semiconductor element. A cap is bonded to both the second substrate and the sealing frame. An interior region is defined by the semiconductor element, the first and second substrates, the cap and the sealing frame. The wires are disposed in the interior region.