The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2001
Filed:
Sep. 16, 1999
Applicant:
Inventor:
Akiyoshi Sawai, Hyogo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/312 ;
U.S. Cl.
CPC ...
H01L 2/312 ;
Abstract
A semiconductor package has a first region having a thickness equivalent to or slightly larger than a semiconductor chip,(0.35 to 0.7 mm) and sealed with resin, and a second region provided on the outside of the first region, having a thickness smaller than that of the first region (0.15 mm to 0.35 mm), and sealed with resin. A semiconductor having a mold package structure capable of preventing the package from warpage can be provided according to this structure.