The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2001
Filed:
Feb. 26, 1999
Amir Koradia, Palatine, IL (US);
Philip A. Ravlin, Bartlett, IL (US);
Douglas J. Pogatetz, Arlington Heights, IL (US);
Gerald A. Greco, Elk Grove Village, IL (US);
3Com Corporation, Rolling Meadows, IL (US);
Abstract
An apparatus for mounting a backplane circuit board to an electronic chassis is provided. An electronic chassis includes a first card guide assembly and a second card guide assembly. The first card guide assembly includes first and second guide pins. The first guide pin of the first card guide assembly is positioned adjacent a first end of the first card guide assembly and the second guide pin of the first card guide assembly is positioned adjacent a second end of the first card guide assembly. The second card guide assembly includes first and second guide pins. The first guide pin of the second card guide assembly is positioned adjacent a first end of the second card guide assembly and the second guide pin of the second card guide assembly is positioned adjacent a second end of the second card guide assembly. A backplane circuit board includes first and second openings to receive the first and second guide pins of the first card guide assembly and third and fourth openings to receive the first and second guide pins of the second card guide assembly. The third and fourth openings have a diameter less than a diameter of the first and second openings to allow a user to first position a bottom portion of the backplane circuit board against the second card guide assembly wherein the third and fourth openings receive the first and second guide pins of the second card guide assembly and second, to position a top portion of the backplane circuit board against the first card guide assembly wherein the first and second openings receive the first and second guide pins of the first card guide assembly to allow proper alignment of the backplane circuit board to the first and second card guide assemblies.