The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2001
Filed:
Oct. 07, 1998
Michael P. Tippner, Cedar Knolls, NJ (US);
Melvin Otto Wilson, Ringoes, NJ (US);
Vlademir Yanefski, Aberdeen, NJ (US);
Lucent Technologies Inc., Murray Hill, NJ (US);
Abstract
A printed wiring board including a first solder mask covering a portion of a first conductor pad. The inner perimeter of the first solder mask extends radially inward of the outer perimeter of the first conductor pad so that a portion of the first connector pad proximate its outer perimeter is covered by the first solder mask. The inner perimeter of the first solder mask is radially outward of the inner perimeter of the first connector pad so that a portion of the first connector pad proximate the inner perimeter of the first connector pad is left exposed. In addition, the printed wiring board may include a second solder mask that covers a portion of a second connector pad. The second solder mask configured with respect to the second connector pad similar to that of the first solder mask with respect to the first connector pad. Alternatively, or in addition to the second connector pad, the printed wiring board may include a conductor path of which at least a portion is covered by a second solder mask. The outer perimeter of the second solder mask is radially outward of the outer perimeter of the conductor pad. Accordingly, the outer perimeters of the solder masks define an exposed area therebetween which is not covered by solder mask. This solder mask configuration increases the distance between exposed metal areas and the roughness of the surface of the backplane therebetween. As a result, the PWB is more resistant to voltage breakdown.