The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2001
Filed:
Jul. 06, 1998
Applicant:
Inventor:
Kazumi Sugai, Tokyo, JP;
Assignee:
NEC Corporation, , JP;
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 ; C23C 1/600 ; H07L 2/144 ;
U.S. Cl.
CPC ...
B05D 5/12 ; C23C 1/600 ; H07L 2/144 ;
Abstract
A method for forming metal thin films for wiring wherein the formation of the metal films by chemical vapor deposition technique is carried out in two steps, with the deposition temperature of the second step being set to be higher than the deposition temperature of the first step, whereby a via hole or a wiring groove can be embedded without the formation of voids. As a result a highly reliable wiring can be achieved even on a fine LSI.