The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2001
Filed:
Jun. 02, 1998
Mitsui Mining and Smelting Co., Ltd., Tokyo, JP;
Abstract
Copper fine powder has an electrical resistance in its powdery state of not more than 1×10,&OHgr;.cm; a BET specific surface area ranging from 0.15 to 0.3 m,/g; a tap density of not less than 4.5 g/cc; a product of the tap density and the particle size, of not less than 13, the particle size being calculated from the specific surface area and a particle size distribution observed in the microtrack measurement as expressed in terms of D,and D,ranging from 4 to 7 &mgr;m and 9 to 11 &mgr;m, respectively; and a weight loss through hydrogen-reduction of not more than 0.30%. The copper fine powder is prepared by adding an alkali hydroxide to an aqueous copper salt solution containing divalent copper ions maintained at not less than 55° C. in an amount of not less than the chemical equivalent to form cupric oxide; then gradually adding a reducing sugar to the reaction system while maintaining the temperature of the system to not less than 55° C. to reduce the cupric oxide to cuprous oxide; followed by filtration and washing, re-suspension to form a slurry, gradual addition of a hydrazine reducing agent to the slurry in the presence of a pH buffer capable of maintaining the pH to 5.5 to 8.5 to thus reduce the cuprous oxide to metal copper.