The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2001
Filed:
Jan. 28, 1999
Applicant:
Inventor:
Michitaka Urushima, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/100 ; B23K 3/102 ; B23K 3/700 ;
U.S. Cl.
CPC ...
B23K 3/100 ; B23K 3/102 ; B23K 3/700 ;
Abstract
A bonding tool for bonding an inner lead to an electrode pad of a semiconductor chip, wherein the bonding tool has a head surface which is rectangular. The rectangular head surface has a long side that is perpendicular to a longitudinal direction of the inner lead and wider than a width of the inner lead, and a short side that is narrower than an opening in a passivation film.
Urushima, Michitaka. (2001). Semiconductor device and equipment for manufacturing the same as well as method of fabricating the same (U.S. Patent No. 6173884). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6173884
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile