The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2001
Filed:
Oct. 09, 1997
Kan Kinouchi, Okazaki, JP;
Yukihiro Kato, Kariya, JP;
Hiroshi Nomura, Nagoya, JP;
Michitake Kuroda, Ama-gun, JP;
Denso Corporation, Kariya, JP;
Abstract
In order to form a hollow portion in a resin block after a molding operation, a projection for forming a hollow portion in a resin block is formed on an upper die. A front face of the projection is processed into a mirror finished face (smoothed flat face). Recess portions are formed in the front face of the projection. The position of the recess portions correspond to wire bonding regions of a lead frame. The lead frame is clamped between an upper die and a lower die. A molding resin is injected into a space between the upper and lower dies. As a result, an excellent wire bonding face can be secured at regions on the lead frame in correspondence with the recess portions.