The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2001
Filed:
Jan. 12, 1999
Satoshi Amano, Tokyo, JP;
Hideshi Tomita, Tokyo, JP;
Nisshinbo Industries, Inc., Tokyo, JP;
Abstract
A resin composition for use in a liquid sealant, which is composed mainly of an epoxy compound, an epoxy resin curing agent and a polycarbodiimide resin, the proportion of the polycarbodiimide resin being 0.1 to 10 parts by weight relative to 100 parts by weight of the epoxy compound, and which is liquid or fluid at ordinary temperature. The liquid sealant comprises a resin composition which is composed mainly of an epoxy compound and a polycarbodiimide resin, the proportion of the polycarbodiimide resin being 0.1 to 10 parts by weight relative to 100 parts by weight of the epoxy compound, an epoxy resin curing agent, an epoxy resin curing accelerator and an inorganic powder. The sealant is liquid or fluid at ordinary temperature.