The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2001
Filed:
Apr. 26, 1996
Masayuki Ogino, Akashi, JP;
Shigehiko Hayashi, Kobe, JP;
Masahito Kawahara, Osaka, JP;
Kazuo Goto, Higashiosaka, JP;
Toru Noguchi, Kobe, JP;
Yoshio Yamaguchi, Kobe, JP;
Mitsuboshi Belting Ltd., Kobe, JP;
Abstract
A layer is provided for bonding a conductive plating to a substrate which substrate normally does not provide firm bonding of plating directly thereto. The bonding layer forms a matrix in which are dispersed ultrafine metal particles. The bonding layer is formed in situ on the substrate surface with the metal particles being maintained unaggregated in the matrix as it is formed on the surface. Plating subsequently formed on the outer surface of the bonding layer is effectively firmly bonded to the substrate through the intermediary of the matrix and metal particles distributed therein. The bonding layer includes a fixative formed of an organic compound including a metal and an organic solvent. The bonding layer may further include a film strengthener.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile