The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2001

Filed:

Mar. 27, 1998
Applicant:
Inventors:

Koichi Warino, Tsukuba, JP;

Toshiyuki Ito, Tsukuba, JP;

Masahiro Suzuki, Tsukuba, JP;

Takao Hosokawa, Tsukuba, JP;

Assignee:

Kuraray Co., Ltd., Kurashiki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 1/100 ; B29C 4/500 ;
U.S. Cl.
CPC ...
B29D 1/100 ; B29C 4/500 ;
Abstract

A molded resin article is prepared by introducing a thermoplastic resin having a temperature greater than a transfer starting temperature into the cavity of a mold, which is retained at a temperature less than the transfer starting temperature, and injection-molding the thermoplastic resin in the mold in which the heat capacity of a surface on the cavity side is set such that the temperature of the thermoplastic resin near the surface of the mold, which resin is cooled in said mold to a temperature less than the transfer starting temperature, is increased again to a temperature exceeding the transfer starting temperature after the cavity is filled with the thermoplastic resin.


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