The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2001
Filed:
Mar. 12, 1998
Steven E. Garcia, League City, TX (US);
Medallion Technology, LLC, Houston, TX (US);
Abstract
A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (,) includes a plurality of leads (,) extending from a surface (,), each of the leads (,) having a seating portion (,) and a stem portion (,). A printed circuit board (,) includes a plurality of plated through holes (,) therein corresponding to the plurality of leads (,) extending from the integrated circuit (,). The steps of the method include positioning the printed circuit board (,) so that a lower surface (,) of the printed circuit board (,) rests on the seating portion (,) of the leads (,) of the integrated circuit (,), and so that the stem portion (,) of each of the leads are positioned within the corresponding plated through holes (,) in the printed circuit board (,). An electrically conductive epoxy adhesive (,) is then dispensed into the holes (,) having the leads (,) therein, and cured to form a solid, electrical, and mechanical connection between the printed circuit board (,) and integrated circuit (,).