The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2001

Filed:

Nov. 01, 1999
Applicant:
Inventors:

David B. Sarraf, Elizabethtown, PA (US);

Jerome E. Toth, Hatboro, PA (US);

Nelson J. Gernert, Elizabethtown, PA (US);

Assignee:

Thermal Corp., Georgetown, DE (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

The invention is an integrated circuit cooler in which a heat spreader is mounted atop a weight sensitive integrated circuit package, and at least one heat pipe is attached to the heat spreader and to a cooling fin assembly remote from the heat spreader. To accommodate to the tolerances, the potential tilt of the installed integrated circuit package, and the weight of the fins, the heat spreader is mounted on the integrated circuit package using springs on posts attached to the circuit mounting board, and the heat pipe has an annealed section of the casing located between the heat spreader and the fins to relieve the potential stress on the thermal connection or the integrated circuit package. Another feature of the assembly is that the fins are mounted on the heat pipe using only spring clamps formed into the fins.


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