The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2001
Filed:
Feb. 04, 2000
Chris Wheaton, San Francisco, CA (US);
Silicon Graphics, Inc., Mountain View, CA (US);
Abstract
The present invention is drawn to a system and a method for attaching and tightening a mechanism onto an IC package such that a load-balanced thermal contact is formed securely between the mechanism and the IC package without risking damages to the IC package. The mechanism is then used to support a heat sink that utilizes the thermal contact formed for dissipating heat away from the IC package. Specifically, the mechanism is modified in stages. During the tightening stage, the mechanism is modified from a first configuration into a second configuration in order to trigger the process of tightening the mechanism securely onto the IC package. More specifically, in its first configuration during the attaching stage, the mechanism includes a spring compressed within a first spacing formed by a bearing plate and a compression screw. Then, the mechanism is modified into the second configuration by the removal of the compression screw, wherein the same spring is compressed at a second spacing formed by the bearing plate and a terminating plate, and wherein the second spacing is longer than the first space as to allow the spring to lengthen to a desired length. As the spring lengthens to its desired length, it pulls the heat sink support towards the IC package and pushes the IC package towards the heat sink support. In so doing, a load-balanced and efficient thermal contact is formed securely between the mechanism and the IC package without risking damages to the IC package.