The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2001

Filed:

Jul. 07, 1999
Applicant:
Inventors:

Kazuaki Takai, Kawasaki, JP;

Kazuaki Kondo, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/7108 ; H01L 2/976 ; H01L 2/994 ; H01L 3/1119 ;
U.S. Cl.
CPC ...
H01L 2/7108 ; H01L 2/976 ; H01L 2/994 ; H01L 3/1119 ;
Abstract

The semiconductor device comprises an electrode,including a first conductive film,formed of an oxide film of a first metal, a second conductive film,formed on the first conductive film,and formed of the first metal, and a third conductive film,formed on the second conductive film,and containing a second metal different form the first metal. The second conductive film is sandwiched between the first conductive film and the third conductive film, whereby adhesion of the third conductive film can be improved, and the release of the third conductive film can be prevented.


Find Patent Forward Citations

Takai, Kazuaki. (2001). Semiconductor device and method for fabricating the same (U.S. Patent No. 6169305). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6169305

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…