The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2001
Filed:
May. 05, 1998
David G. Love, Pleasanton, CA (US);
Patricia R. Boucher, Fremont, CA (US);
David A. Horine, Los Altos, CA (US);
Fujitsu Limited, , JP;
Abstract
A method of assembling thin film jumper connectors to a substrate as part of a process of manufacturing a multi-chip-module or other device having multiple components bonded to chip carrier or other substrate. An alignment plate is positioned on the chuck of a standard flip-chip bonding machine. The thin film jumper connectors are placed on the alignment plate in a face-up position after alignment to alignment marks on the plate using the machine's moveable platform and split-field viewer. The jumper connectors are held to the alignment plate by a force supplied by the vacuum system of the flip-chip bonder, with the force being transmitted to the jumpers through vacuum holes in the alignment plate. The plate's alignment marks are positioned so that when they are aligned with corresponding marks on the connectors, the bonding pads on the connectors are correctly aligned to the pads on the substrate. The substrate or chip carrier is then placed on the moveable platform and rotated to a face-down position. The substrate is moved into a coarse position over the thin film connectors, aligned with the split-field viewer, and then lowered into contact with the contacts of the connectors. The entire assembly, including the alignment plate is then placed in a reflow furnace or otherwise heated to cause the solder bumps on the thin film connector pads to make good electrical contact with the bonding pads on the substrate. Depending on the thermal relationships between the integrated circuit chips, the thin film connectors, and the substrate, the chips may be connected to the substrate either before or after the thin film jumper connectors are bonded to the substrate. If the chips are connected prior to the assembly of the thin film connectors, then a chip cavity is formed in the alignment plate to prevent contact between the chips and the bonding apparatus during the thin film connector bonding.