The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2001

Filed:

Dec. 04, 1998
Applicant:
Inventors:

Hideo Mitsuhashi, Tokyo, JP;

Satoshi Ohi, Tokyo, JP;

Atsushi Yamamori, Tokyo, JP;

Shoichi Inaba, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F 1/02 ; B24B 5/00 ; B24B 2/900 ;
U.S. Cl.
CPC ...
C23F 1/02 ; B24B 5/00 ; B24B 2/900 ;
Abstract

A wafer polishing apparatus has a rotary polishing bed, an abrasive cloth provided on the polishing bed, an abrasive supply supplying abrasives to a surface of the abrasive cloth, a wafer depressor depressing the wafer onto the abrasive cloth at a predetermined pressure, a ring shaped retainer arranged surrounding the wafer and provided with a plurality of grooves extending between an inner peripheral edge and an outer peripheral edge on a surface contacting with the abrasive cloth, a rotary driver driving the wafer and the retainer on the abrasive cloth, and a rotation speed difference generator providing a difference of rotation speeds between the wafer and the retainer.


Find Patent Forward Citations

Mitsuhashi, Hideo. (2001). Wafer polishing apparatus and polishing method (U.S. Patent No. 6168684). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6168684

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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