The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2001
Filed:
Oct. 14, 1998
Peter Joseph Sinkunas, Canton, MI (US);
Visteon Global Technologies, Inc., Dearborn, MI (US);
Abstract
There is disclosed herein a method for soldering an electronic component,having a heatspreader,on a bottom surface thereof and at least one lead,(e.g., a DPAK-type component) to a circuit board,having a heatspreader mounting pad,and at least one lead mounting pad,, comprising the steps of: (a) depositing solder paste,on the heatspreader mounting pad,and on each of the at least one lead mounting pad,; (b) placing the electronic component,on the circuit board,such that the heatspreader,rests atop the heatspreader mounting pad,and each lead,rests atop a respective one of the at least one lead mounting pad,; (c) directing a laser energy beam,from a diode laser,at the heatspreader,and/or at the heatspreader mounting pad,for a first predetermined length of time, thereby heating the solder paste,on the pad,; and (d) continuing to direct the laser energy beam,at the heatspreader/pad,for a second predetermined length of time while simultaneously feeding a predetermined amount of flux-core wire solder,into the laser energy beam,proximate the heatspreader,, such that the wire solder,melts and flows onto at least one of the heatspreader,and the heatspreader mounting pad