The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2000

Filed:

Sep. 16, 1998
Applicant:
Inventors:

David T Winslow, Los Angeles, CA (US);

Clifton Quan, Arcadia, CA (US);

Hernan E Romero, Los Angeles, CA (US);

Claudio S Howard, Hawthorne, CA (US);

Edward L Robertson, Culver City, CA (US);

Assignee:

Raytheon Company, Lexington, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P / ;
U.S. Cl.
CPC ...
333260 ; 333243 ; 439 66 ; 439 91 ; 439248 ;
Abstract

An RF connector includes male and female connector components. The male component has a multi-diameter dielectric housing cylinder with a metal center conductor extending through an opening in the housing. The center pin extends from each end of the dielectric housing. The center pin and the dielectric housing are sized appropriately to provide a matched impedance at microwave frequencies for the use environment to which the male component is connected. The female connector component includes a dielectric body having a center cavity formed therein. A compressible wire bundle forming a compressible conductor member is recessed into the cavity. The compressible conductor protrudes from the far end of the female cavity allowing contact to a mating circuitry. The male connector component is assembled with the female component, the male center pin being brought into electrical contact with the compressible conductor member. The female connector component is not mechanically mounted to the next level of interconnect, but instead the protruding compressible conductor is brought into compressive electrical contact with a mating circuitry on the next interconnect level.


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