The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2000

Filed:

Aug. 05, 1999
Applicant:
Inventor:

Brian J Jensen, Williamsburg, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ; C08F / ; C08F / ; C08G / ;
U.S. Cl.
CPC ...
528480 ; 528125 ; 528128 ; 528172 ; 528173 ; 528176 ; 528183 ; 528185 ; 528188 ; 528220 ; 528229 ; 528350 ; 528491 ; 528492 ; 528493 ; 524600 ; 524602 ; 524607 ; 4284111 ; 4284735 ; 525422 ; 525436 ;
Abstract

Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of a non-reactive endcapper, such as phthalic anhydride. Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. Polyimides that are more rigid in nature require more APB to impart processability than polyimides that are less rigid in nature. The copolymers that result from using APB to enhance processability have a unique combination of properties including: excellent thin film properties, low pressure processing (200 psi and below), improved toughness, improved solvent resistance, improved adhesive properties, improved composite mechanical properties, long term melt stability (several hours at 390 C.), and lower melt viscosities.


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