The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2000

Filed:

Apr. 10, 1997
Applicant:
Inventors:

Stephen J Fonash, State College, PA (US);

Reece Kingi, Auckland, NZ;

Ali K Kalkan, State College, PA (US);

Assignee:

The Penn State Research Foundation, University Park, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; B05D / ;
U.S. Cl.
CPC ...
438486 ; 438482 ; 427508 ; 427509 ; 427521 ; 427559 ; 427125 ; 42725518 ; 42725527 ; 4273762 ;
Abstract

This invention is directed toward methods for fabricating polycrystalline thin films. More particularly, the invention is directed toward optimized solid phase crystallization of plasma enhanced chemical vapor deposited amorphous silicon thin films as a means for obtaining, with a low thermal budget, polycrystalline silicon thin films comprising larger grain sizes and smother surfaces. The process of plasma enhanced chemical vapor deposition is quantified for silane containing various types of dilutants, thereby allowing deposition temperature, type of dilutant, type of plasma and other parameters to be controlled to yield the desired crystallization grain size at the desired thermal budget. Methods of annealing, annealing temperature, and pre-annealment treatments are also quantified such that grain size and thermal budget can be controlled in the fabrication of polycrystalline silicon thin films. Methods and apparatus for the select regional crystallization of an originally amorphous thin film using photon radiation is disclosed, wherein these methods and apparatus yield polycrystalline thin films with maximum grain size at a minimum thermal budget.


Find Patent Forward Citations

Loading…