The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2000
Filed:
Apr. 14, 1999
Nick Lin, Hsing-Chuang, TW;
Cheng-Hung Lin, Chung-Ho, TW;
Hon Hai Precision Ind. Co., Ltd., Taipei Hsien, TW;
Abstract
A package socket system includes a positioning frame positioned on a circuit board. The positioning frame has an interior space defined between four side walls for receiving and accommodating a BGA socket that retains an array of contacts therein. The contacts have a lower ball end in contact engagement with and supported on conductive pads of the circuit board. A BGA package having an array of solder balls is received in the positioning frame and supported on the socket with the solder balls received in flared upper ends of the contacts of the socket. A heat sink has a flat base supported on the positioning frame and secured to the substrate to establish a firm contact engagement with the package thereby securely maintaining the package and the socket in position on the substrate. The positioning frame has a chamfered section and the socket and the package each have a corresponding chamfered corner for positioning purposes.