The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2000
Filed:
Aug. 05, 1999
Masahiro Fujii, Shiojiri, JP;
Keiichi Mukaiyama, Matsumoto, JP;
Hiroyuki Maruyama, Misato-mura, JP;
Tadaaki Hagata, Shiojiri, JP;
Yoshio Maeda, Fujimi-machi, JP;
Hiroshi Komatsu, Shimosuwa-machi, JP;
Mitsuro Atobe, Chino, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A manufacturing method for a device having an electrostatic actuator for example inkjet head, whereby warping of the diaphragms does not occur as a result of anodic bonding is provided. The method comprises the steps of etching a first substrate on the first surface thereof to form a concave portion and a diaphragm provided in bottom walls of the concave portion, forming an electrode on a second substrate, and anodically bonding the second substrate to a second surface of the first substrate, opposite the first surface, such that the electrode is aligned adjacent to the diaphragm with a gap therebetween. The bonding temperature of the anodically bonding step is set within a temperature range whereby the contraction of the first substrate after bonding is equal to or greater than the contraction of the second substrate.