The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2000

Filed:

Jul. 29, 1994
Applicant:
Inventor:

Shahid S Ansari, Milpitas, CA (US);

Assignee:

Sun Microsystems, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R / ;
U.S. Cl.
CPC ...
714734 ;
Abstract

A method and apparatus for testing an integrated circuit in a system level environment such that the integrated circuit to be tested is wired into a system or module when the testing occurs is disclosed. In one embodiment of a method aspect of the invention, a die in a packaged integrated circuit to be tested is exposed. A module that incorporates the exposed die is placed on a test platform. The test platform and a sensor probe are relatively positioned such that the sensor probe can directly monitor the exposed die during testing. The positioning may be accomplished by moving the test platform, the sensor probe or both. The system is then driven in a manner which exercises the exposed die. The sensor probe then directly monitor the die while the exposed die is being exercised. The die can be exposed in a variety of manners as for example by removing a package cover or by etching portions of the plastic packaging material. An integrated circuit tester suitable for implementing this process is also disclosed as well as a test board suitable for use when the integrated circuits being tested are cavity down packaged integrated circuits.


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