The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2000

Filed:

Feb. 22, 1999
Applicant:
Inventor:

Mike Strickler, Boise, ID (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ;
U.S. Cl.
CPC ...
361695 ; 174 / ; 361818 ;
Abstract

A storage enclosure is provided for electrical/electronic components. The storage enclosure includes an enclosure, an EMI barrier, air flow inlet apertures and exhaust air flow apertures. The enclosure has at least one wall configured to house an electrical/electronic component. The EMI barrier wall has air flow apertures sized sufficiently small to prevent passage of undesirable relatively high frequency EMI/RFI emissions. The barrier wall is supported internally of the enclosure and is configured to subdivide the enclosure into a component enclosure and a cooling fan module enclosure. The air flow inlet apertures are provided in the component enclosure to draw cooling air into the component enclosure and cool components contained therein. The exhaust air flow apertures are sized larger than the EMI barrier apertures and the air flow inlet apertures, and are provided in the cooling fan module enclosure to expel cooling air from the cooling fan module out of the storage enclosure. The component enclosure is configured to contain relatively high frequency EMI/RFI emissions that emanate from components contained therein, and the cooling fan module enclosure is configured to contain relatively low frequency EMI/RFI emissions that emanate from a fan module contained therein while providing for a relatively large passage of cooling air from the storage enclosure. A method is also provided.


Find Patent Forward Citations

Loading…